ATE测试板

盛华ATE测试板制程能力

专业制造: ATE测试板,探针卡板,老化板等半导体测试接口板

Max. Board Thickness (mm)

6.3

Min. Drilled Via Size (mm/mil)

0.15/6

Trace & Space(mm)

0.075/0.075

Impedance Control

+/- 10%

Surface Finish

Electrolytic Nickel Hard Gold

E-less Nickel Immersion Gold

Materials

Inventory Complete